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2016

Curvature sensitive analysis of axially compressed cylindrical tubes with corrugated surface using isogeometric analysis and experiment

Imai, T., Shibutani, T., Matsui, K., Kumagai, S., Tran, D. T., Mu, K. & Maekawa, T. 2016 Dec 1 In : Computer Aided Geometric Design. 49, p. 17-30 14 p.

Research output: Contribution to journalArticle

Energy absorption
Experiments
Splines
Wavelength
4 Citations

Effect of gasoline pool fire on liquid hydrogen storage tank in hybrid hydrogen-gasoline fueling station

Sakamoto, J., Nakayama, J., Nakarai, T., Kasai, N., Shibutani, T. & Miyake, A. 2016 Jan 21 In : International Journal of Hydrogen Energy. 41, 3, p. 2096-2104 9 p.

Research output: Contribution to journalArticle

Gasoline
Liquids
Hydrogen storage
Hydrogen
Fueling

Findings from the benchmark analyses on an elbow in-plane bending test and a piping system test

Nakamura, I., Otani, A., Shibutani, T., Morishita, M. & Shiratori, M. 2016 Seismic Engineering. American Society of Mechanical Engineers (ASME), Vol. 8, V008T08A007

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Piping systems
Pipe
Bending tests
Plastics
Seismic design

IoT-Based Prognostics and Systems Health Management for Industrial Applications

Kwon, D., Hodkiewicz, M. R., Fan, J., Shibutani, T. & Pecht, M. G. 2016 In : IEEE Access. 4, p. 3659-3670 12 p., 7520653

Research output: Contribution to journalArticle

Health
Internet of things
Sensors
Industry
Consumer products

Leakage-type-based analysis of accidents involving hydrogen fueling stations in Japan and USA

Sakamoto, J., Sato, R., Nakayama, J., Kasai, N., Shibutani, T. & Miyake, A. 2016 Dec 14 In : International Journal of Hydrogen Energy. 41, 46, p. 21564-21570 7 p.

Research output: Contribution to journalArticle

Fueling
Hydrogen
Pipe
Flanges
Seals
3 Citations
Hydrogen
Fueling
Hazards
Organic chemicals
Hydrides
2015
Electronic equipment
Planning
Industry
Supply chains
Scheduling

Failure analysis of piping systems with thinned elbows on tri-axial shake table tests

Shibutani, T., Nakamura, I. & Otani, A. 2015 Feb 1 In : Journal of Pressure Vessel Technology, Transactions of the ASME. 137, 1, 011205

Research output: Contribution to journalArticle

Piping systems
Failure analysis
Plastic deformation
History
Pipe

Introduction of a research activity on the seismic safety evaluation of nuclear piping systems taking the effect of elastic-plastic behavior into account

Nakamura, I., Morishita, M., Shiratori, M., Shibutani, T., Otani, A. & Nakamura, H. 2015 Codes and Standards. American Society of Mechanical Engineers (ASME), Vol. 1B

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Piping systems
Plastics
Nuclear power plants
Pipe
Seismic design
1 Citations

Risk assessment for a gas and liquid Hydrogen fueling station

Nakayama, J., Sakamoto, J., Kasai, N., Shibutani, T. & Miyake, A. 2015 49th Annual Loss Prevention Symposium 2015, LPS 2015 - Topical Conference at the 2015 AIChE Spring Meeting and 11th Global Congress on Process Safety. AIChE, p. 138-150 13 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hydrogen
Fueling
Risk assessment
Gasoline
Hazards
2014

Fatigue damage estimation in a three-dimensional piping system under seismic loadings

Shibutani, T., Nakamura, I. & Otani, A. 2014 Jan 1 American Society of Mechanical Engineers, Pressure Vessels and Piping Division (Publication) PVP. American Society of Mechanical Engineers (ASME), Vol. 8

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Piping systems
Fatigue damage
Seismic waves
Miners
Simulators
2012

In-situ observation of whisker nucleation in air with AFM

Onuki, H. & Shibutani, T. 2012 Dec 1 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012. 6523424

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Air
Atomic force microscopy
Nucleation
Vacuum

Intention to the special edition

Shibutani, T. 2012 Aug 1 In : Journal of Japan Institute of Electronics Packaging. 15, 5

Research output: Contribution to journalArticle

12 Citations

Precursor monitoring approach for reliability assessment of cooling fans

Oh, H., Shibutani, T. & Pecht, M. 2012 Apr 1 In : Journal of Intelligent Manufacturing. 23, 2, p. 173-178 6 p.

Research output: Contribution to journalArticle

Fans
Cooling
Health
Monitoring
Testing

State-of-the-art in nonlinear CAE for electronic packaging

Shibutani, T. 2012 Aug 1 In : Journal of Japan Institute of Electronics Packaging. 15, 5, p. 400-403 4 p.

Research output: Contribution to journalArticle

Electronics packaging
Computer aided engineering
8 Citations

Topologically robust B-spline surface reconstruction from point clouds using level set methods and iterative geometric fitting algorithms

Yoshihara, H., Yoshii, T., Shibutani, T. & Maekawa, T. 2012 Oct 1 In : Computer Aided Geometric Design. 29, 7, p. 422-434 13 p.

Research output: Contribution to journalArticle

Splines
Surface reconstruction
Topology
2011

Failure analysis of piping systems with thinned elbows on tri-axial shake table tests

Shibutani, T., Nakamura, I. & Otani, A. 2011 Dec 1 American Society of Mechanical Engineers, Pressure Vessels and Piping Division (Publication) PVP. Vol. 8, p. 131-136 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Piping systems
Failure analysis
Plastic deformation
History
Pipe

Investigation of the seismic safety capacity of aged piping system - Shake table test on piping systems with wall thinning by E-Defense

Nakamura, I., Otani, A., Sato, Y., Takada, H., Takahashi, K. & Shibutani, T. 2011 Dec 1 American Society of Mechanical Engineers, Pressure Vessels and Piping Division (Publication) PVP. Vol. 8, p. 121-129 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Piping systems
Degradation
Experiments
2010

Deformation of resin material due to curing in the thermal process

Sone, R., Yu, Q. & Shibutani, T. 2010 Jun 25 Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 1, p. 953-958 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Resins
Curing
Thermal load
Strength of materials

Dispersion and evaluation of thermal fatigue reliability for solder joint by using normal random numbers

Maruoka, T., Yu, Q. & Shibutani, T. 2010 Apr 16 2010 Prognostics and System Health Management Conference, PHM '10. 5413342

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fatigue of materials
Thermal fatigue
Weibull distribution
Crack initiation
8 Citations

Effect of grain size on pressure-induced tin whisker formation

Shibutani, T. 2010 Jul 1 In : IEEE Transactions on Electronics Packaging Manufacturing. 33, 3, p. 177-182 6 p., 5437214

Research output: Contribution to journalArticle

Tin
Nanoindentation
Interfacial energy
Nucleation
Finite element method

Reflow process simulation for dispersion evaluation of solder joint shape on chip component

Takagi, K., Yu, Q., Shibutani, T. & Miyauchi, H. 2010 Jul 1 Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2, p. 1-8 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Surface tension
Automobile electronic equipment
Contact angle
Crack propagation
8 Citations

Reliability evaluation on deterioration of power device using coupled electrical-thermal-mechanical analysis

Anzawa, T., Yu, Q., Yamagiwa, M., Shibutani, T. & Shiratori, M. 2010 Dec 1 In : Journal of Electronic Packaging, Transactions of the ASME. 132, 3, 031012

Research output: Contribution to journalArticle

Thermoanalysis
Temperature distribution
Fatigue of materials
Wire
Cracks

Study on high reliable design method for lead-free solder joints on electronic components

Takagi, K., Yu, Q., Shibutani, T. & Noro, Y. 2010 Aug 9 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501281

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Crack propagation
Soldering
Lead-free solders
Automobile electronic equipment
2009

Effect of irregular grown intermetallic compounds network on tin whisker formation

Shibutani, T., Yamashita, T., Qiang, Y. & Shiratori, M. 2009 Jan 1 In : Journal of Japan Institute of Electronics Packaging. 12, 1, p. 53-61 9 p.

Research output: Contribution to journalArticle

Intermetallics
Tin
Stress concentration
Tinning
Plating
Resins
Silicon
Bending tests
Cracks
Finite element method
Fatigue of materials
Soldering alloys
Thermal fatigue
Miners
Sensitivity analysis

Identification of failure precursor parameters for cooling fans

Oh, H., Shibutani, T. & Pecht, M. 2009 Proceedings of the ASME Design Engineering Technical Conference. PARTS A AND B ed. Vol. 2, p. 1253-1258 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fans
Cooling
Health
Testing
Military equipment

Reliability analysis of solder joint on power module

Yu, Q., Anzawa, T., Yamagiwa, M., Shibutani, T. & Shinohara, K. 2009 Oct 1 In : Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A. 75, 758, p. 1340-1346 7 p.

Research output: Contribution to journalArticle

Soldering alloys
Crack propagation
Fatigue of materials
Cracks
Thermal fatigue
9 Citations

Standards for tin whisker test methods on lead-free components

Shibutani, T., Osterman, M. & Pecht, M. 2009 Mar 31 In : IEEE Transactions on Components and Packaging Technologies. 32, 1, p. 216-219 4 p.

Research output: Contribution to journalArticle

Tin
2 Citations
Soldering alloys
Crack propagation
Fatigue of materials
Cracks
Automobile electronic equipment
Soldering alloys
Fatigue of materials
Automobile electronic equipment
Lead-free solders
Soldering alloys
Chip scale packages
Weibull distribution
Thermal shock
Fatigue of materials
2008

A study on evaluation technique for the fatigue life scatter of lead-free solder joints

Miyauchi, H., Yu, Q., Shibutani, T. & Shiratori, M. 2008 May 28 ASME International Mechanical Engineering Congress and Exposition, Proceedings. Vol. 5, p. 325-332 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fatigue of materials
Lead-free solders
Thermal fatigue
Power electronics

Delamination evaluaion approach for bimaterial structure considering interfacial layer

Yu, Q., Shibutani, T., Shiratori, M., Matsuzaki, T. & Matsumoto, T. 2008 May 28 ASME International Mechanical Engineering Congress and Exposition, Proceedings. Vol. 5, p. 319-324 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Resins
Delamination
Finite element method
Electronics packaging
Thermal fatigue
2 Citations

Development of evaluation approach for delamination considering micro-scale interfacial layer structure between resin and silicon

Matsumoto, T., Yu, Q., Shibutani, T. & Matsuzaki, T. 2008 Dec 1 10th Electronics Packaging Technology Conference, EPTC 2008. p. 816-820 5 p. 4763532

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Resins
Bending tests
Delamination
Soldering alloys
Thermal expansion

Development of evaluation approach for delamination considering micro-scale interfacial layer structure between Resin and Silicon

Matsumoto, T., Yu, Q., Shibutani, T. & Matsuzaki, T. 2008 Dec 1 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 289-292 4 p. 4784285

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Resins
Bending tests
Delamination
Soldering alloys
Thermal expansion

Dispersion and the worst case of thermal fatigue life of solder joints in vehicle electronic devices

Maruoka, T., Qiang, Y. U., Shibutani, T. & Miyauci, H. 2008 IEEE International Integrated Reliability Workshop Final Report. p. 129-132 4 p. 4796103

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fatigue of materials
Thermal fatigue
Cracks
Dispersions

Effect of creep properties on pressure induced tin whisker formation

Shibutani, T., Yu, Q. & Shiratori, M. 2008 Sep 19 Proceedings - The 2nd IEEE International Conference on Secure System Integration and Reliability Improvement, SSIRI 2008. p. 197-198 2 p. 4579822

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Creep
Tin
Nanoindentation
Indentation
Plating
27 Citations

Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints

Yu, Q., Shibutani, T., Kim, D. S., Kobayashi, Y., Yang, J. & Shiratori, M. 2008 Mar 1 In : Microelectronics Reliability. 48, 3, p. 431-437 7 p.

Research output: Contribution to journalArticle

Fatigue of materials
Soldering alloys
Thermal fatigue
Crack propagation
Cracks
8 Citations

Key reliability concerns with lead-free connectors

Shibutani, T., Wu, J., Yu, Q. & Pecht, M. 2008 Oct 1 In : Microelectronics Reliability. 48, 10, p. 1613-1627 15 p.

Research output: Contribution to journalArticle

Fretting corrosion
Contact resistance
Soldering alloys
Tin
8 Citations

Power cycle fatigue reliability evaluation for power device using coupled electrical-thermal-mechanical analysis

Anzawa, T., Yu, Q., Yamagiwa, M., Shibutani, T. & Shiratori, M. 2008 Sep 9 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM. p. 815-821 7 p. 4544351

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal fatigue
Joule heating
Temperature distribution
Wire
Switching frequency
25 Citations

Pressure-induced tin whisker formation

Shibutani, T., Yu, Q., Shiratori, M. & Pecht, M. G. 2008 Jul 1 In : Microelectronics Reliability. 48, 7, p. 1033-1039 7 p.

Research output: Contribution to journalArticle

Tin
Creep
Plating
Grain boundaries

Reliability evaluation for solder joints in embedded electronic packages considering the effect of adhesion of the interfaces

Yu, Q., Miyauchi, H., Shibutani, T., Andersson, K., Ojala, K. & Lasarov, H. 2008 Dec 1 IMAPS Nordic Annual Conference 2008. p. 140-145 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Adhesion
Soldering alloys
Engineers
Thermal load
Delamination

Reliability evaluation for solder joints in embed electronic package

Yamabe, M., Yu, Q., Shibutani, T., Miyauchi, H., Shiratori, M. & Ohhashi, H. 2008 May 15 Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6798, 67980S

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electronics packaging
Silicones
Soldering alloys
Engineers
2 Citations

Reliability evaluation on deterioration of power device using coupled electrical-thermal-mechanical analysis

Anzawa, T., Yu, Q., Yamagiwa, M., Shibutani, T. & Shiratori, M. 2008 Dec 1 2008 2nd International Conference on Thermal Issues in Emerging Technologies, ThETA 2008. p. 319-324 6 p. 5167181

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue of materials
Temperature
Thermal fatigue
Insulated gate bipolar transistors (IGBT)
Electric currents

Simple design support method for thermal reliability of BGA packages

Saji, K., Yu, Q. & Shibutani, T. 2008 Dec 1 IET Seminar Digest. 2 ed. Vol. 2008

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ball grid arrays
Thermal fatigue
Fatigue of materials
Cluster analysis
Polychlorinated biphenyls
2 Citations

Study of thermal fatigue life caused by dispersion of solder joint

Takagi, K., Yu, Q., Shibutani, T., Miyauchi, H., Shiratori, M. & Noro, Y. 2008 Sep 9 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM. p. 638-651 14 p. 4544359

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fatigue of materials
Resistors
Crack propagation
Thermal fatigue