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2015
9 Citations

A method to investigate strain rate effects on necking and fracture behaviors of advanced high-strength steels using digital imaging strain analysis

Sato, K., Yu, Q., Hiramoto, J., Urabe, T. & Yoshitake, A. 2015 Jan 1 In : International Journal of Impact Engineering. 75, p. 11-26 16 p.

Research output: Contribution to journalArticle

Strain rate
High strength steel
High speed cameras
Video cameras
Imaging techniques

Study on fatigue reliability evaluation for lead free solder joints

Mizukami, D., Matsuo, R. & Yu, Q. 2015 Feb 24 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 117-120 4 p. 7048364

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kinematics
Hardening
Fatigue of materials
Cracks
Lead-free solders

Study on local deformation of void affecting mechanical property of nanomaterial

Saito, Y., Yoden, K., Okuno, S. & Yu, Q. 2015 Feb 24 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 242-245 4 p. 7048363

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nanostructured materials
Mechanical properties
Structural analysis
Cracks
Crack initiation
2014

Proposal of the application of the delamination test to semiconductor package design

Kusama, R., Ishikawa, T., Yu, Q., Yamashita, K. & Takeda, T. 2014 Jan 1 2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society, p. 732-735 4 p. 6826777

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Delamination
Sheet molding compounds
Computer aided engineering
Tensile stress
Loads (forces)
2013
2 Citations
Fatigue of materials
Thermal fatigue
Thermal cycling
Printed circuit boards
Finite element method
Thermal fatigue
Fatigue of materials
Laminating
Glass
Printed circuit boards
2012

A study on evaluation method for reliability of Nano-metal pastes of high temperature resistant of power devices

Cui, M., Oshidari, T. & Yu, Q. 2012 Dec 1 Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. p. 705-710 6 p. 6507173

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plating
Temperature
Mountings
Packaging
Metals

A study on evaluation method of new packaging structure for high-temperature power device

Higuchi, A., Yu, Q., Oshidari, T. & Cui, M. 2012 Dec 1 14th International Conference on Electronic Materials and Packaging, EMAP 2012. 6507918

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plating
Temperature
Packaging
Finite element method
Materials properties

Development of thermal fatigue sensor for electrical and electronic equipment

Minakata, Y., Yu, Q. & Takagi, K. 2012 Dec 1 14th International Conference on Electronic Materials and Packaging, EMAP 2012. 6507847

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sensors
Thermal fatigue
Level control
Electronic equipment
Thermal expansion

Investigation of thermal fatigue life scatter of IVH in PWB

Takenaka, K. & Yu, Q. 2012 Sep 18 InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM. p. 194-201 8 p. 6231430

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue of materials
Thermal fatigue
Finite element method
Printed circuit boards
Thermal cycling

Measurement methods for curing properties of resin considering process condition

Takeda, T., Yu, Q. & Sato, H. 2012 Sep 18 InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM. p. 256-260 5 p. 6231438

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Curing
Resins
Packaging
Analytical models
Elastic moduli

Reliable evaluation method for solder joints in vehicle electronics devices considering the actual use conditions

Okuyama, S., Yu, Q. & Akutsu, T. 2012 Sep 18 InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM. p. 654-658 5 p. 6231490

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fatigue of materials
Finite element method
Thermal fatigue
Miners

Study on thermal design due to downsizing of power module using coupled electrical-thermal-mechanical analysis

Yamada, Y., Yu, Q., Takahashi, T. & Takagi, Y. 2012 Dec 1 14th International Conference on Electronic Materials and Packaging, EMAP 2012. 6507917

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal fatigue
Power electronics
Energy efficiency
Temperature distribution
Finite element method

Use of temperature as a health monitoring tool for solder interconnect degradation in electronics

Chauhan, P., Osterman, M., Pecht, M. & Yu, Q. 2012 Sep 18 Proceedings of IEEE 2012 Prognostics and System Health Management Conference, PHM-2012. 6228874

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Temperature
Soldering alloys
Health
Degradation
Monitoring
2011
1 Citations

Application of CAP to analyze mechanisms producing dummy injury readings under U.S. side impact test conditions

Fujiyama, Y., Sonoyama, D., Obayashi, K. & Yu, Q. 2011 Jul 6 SAE 2011 World Congress and Exhibition.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Railroad cars
Computer aided engineering
Insurance
Seats

A study on reliability of high-temperature joint in packaging structure

Ishikawa, T., Oshidari, T., Sugihara, H. & Yu, Q. 2011 Dec 1 ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 1, p. 45-51 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plating
Temperature
Mountings
Aluminum
Bending tests

A study on the thermal deformation and the mechanical properties due to curing process of the encapsulation resin

Sato, H., Yu, Q. & Sone, R. 2011 Dec 1 ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 1, p. 185-190 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Curing
Resins
Aluminum
Mechanical properties
Correlation methods

Effect of micro structure on fatigue characteristics of lead free solder joints

Akutsu, T. & Yu, Q. 2011 Dec 1 ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 2, p. 691-700 10 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fatigue of materials
Finite element method
Crystals
Microstructure
4 Citations

Fatigue life evaluation accuracy of power devices using finite element method

Shinohara, K. & Yu, Q. 2011 Sep 1 In : International Journal of Fatigue. 33, 9, p. 1221-1234 14 p.

Research output: Contribution to journalArticle

Fatigue of materials
Soldering alloys
Temperature distribution
Finite element method
Temperature

Measurement methods for curing properties of resin considering process condition and effects on package

Takeda, T. & Yu, Q. 2011 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011. p. 354-357 4 p. 6184445

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Resins
Curing
Elastic moduli
Packaging
Aluminum

Precision evaluation for thermal fatigue life of power module using coupled electrical-thermal-structural analysis

Takahashi, T., Yu, Q. & Kobayashi, M. 2011 Dec 1 ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 1, p. 157-163 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal fatigue
Fatigue of materials
Soldering alloys
Wire
Structural analysis

Reliability evaluation of electronic devices under considering the actual use conditions

Liu, S., Yu, Q. & Pecht, M. 2011 ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 1, p. 201-205 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polychlorinated biphenyls
Fatigue of materials
Semiconductor materials

Reliability evaluation of fatigue life for solder joints in chip components considering dispersion of the shape and the properties

Nishimura, Y. & Yu, Q. 2011 Dec 1 ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 1, p. 191-194 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue of materials
Soldering alloys
Railroad cars
Fibers
Miners

Study on high reliability of lead-free solder joint on metal substrate

Takagi, K., Wakabayashi, M., Inoue, J., Yu, Q. & Akutsu, T. 2011 Dec 1 ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 1, p. 143-148 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Substrates
Metals
Crack propagation
Thermal conductivity

The effect of the surface roughness of al layer of DBA substrate on fatigue life of solder joint in power-devices

Zhao, S., Yu, Q. & Akaeda, H. 2011 Dec 1 ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 1, p. 195-199 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Surface roughness
Aluminum
Substrates
Soldering alloys
Fatigue of materials
2010

A study on reliability of Ni plating in a high temperature power device

Ishikawa, T., Oshidari, T., Sugihara, H. & Yu, Q. 2010 Aug 9 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501283

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plating
Temperature
Bending tests
Stress relaxation
Cooling systems

A verification of application specific component qualification

Challa, V., Pecht, M., Liu, S. & Yu, Q. 2010 Nov 24 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. p. 1265-1268 4 p. 5582783

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polychlorinated biphenyls
Fatigue of materials
Semiconductor materials

Deformation of resin material due to curing in the thermal process

Sone, R., Yu, Q. & Shibutani, T. 2010 Jun 25 Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 1, p. 953-958 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Resins
Curing
Thermal load
Strength of materials

Dispersion and evaluation of thermal fatigue reliability for solder joint by using normal random numbers

Maruoka, T., Yu, Q. & Shibutani, T. 2010 Apr 16 2010 Prognostics and System Health Management Conference, PHM '10. 5413342

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fatigue of materials
Thermal fatigue
Weibull distribution
Crack initiation

Effect of micro structure on fatigue characteristics of lead free solder joints

Akutsu, T., Yu, Q. & Nishimura, Y. 2010 Dec 1 2010 12th Electronics Packaging Technology Conference, EPTC 2010. p. 550-555 6 p. 5702700

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fatigue of materials
Finite element method
Crystals
Lead-free solders

High-accuracy fatigue evaluation of power devices by multi-coupled analysis

Shinohara, K., Yu, Q., Anzawa, T. & Ishii, H. 2010 Jun 30 Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2, p. 19-26 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Insulated gate bipolar transistors (IGBT)
Semiconductor devices
Fatigue of materials
Semiconductor materials
Hybrid vehicles
1 Citations

Precision evaluation for thermal fatigue life of power module using coupled electrical-thermal-mechanical analysis

Takahashi, T. & Yu, Q. 2010 Dec 1 2010 12th Electronics Packaging Technology Conference, EPTC 2010. p. 201-205 5 p. 5702634

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal fatigue
Fatigue of materials
Soldering alloys
Wire
Temperature distribution

Reflow process simulation for dispersion evaluation of solder joint shape on chip component

Takagi, K., Yu, Q., Shibutani, T. & Miyauchi, H. 2010 Jul 1 Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2, p. 1-8 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Surface tension
Automobile electronic equipment
Contact angle
Crack propagation

Reliability evaluation for specify factor of fatigue on power device

Kobayashi, M. & Yu, Q. 2010 Apr 16 2010 Prognostics and System Health Management Conference, PHM '10. 5414564

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue of materials
Soldering alloys
Wire
Aluminum
Temperature

Reliability evaluation for specifying fatigue mode in power device

Kobayashi, M. & Yu, Q. 2010 Dec 28 16th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2010. p. 33-38 6 p. 5636362

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue of materials
Soldering alloys
Wire
Aluminum
Temperature

Reliability evaluation of power semiconductor devices using coupled analysis simulation

Shinohara, K. & Yu, Q. 2010 Aug 9 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501267

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue of materials
Semiconductor devices
Deterioration
Current density
Electricity
8 Citations

Reliability evaluation on deterioration of power device using coupled electrical-thermal-mechanical analysis

Anzawa, T., Yu, Q., Yamagiwa, M., Shibutani, T. & Shiratori, M. 2010 Dec 1 In : Journal of Electronic Packaging, Transactions of the ASME. 132, 3, 031012

Research output: Contribution to journalArticle

Thermoanalysis
Temperature distribution
Fatigue of materials
Wire
Cracks

Reliability study of high-temperature-resistant mounting structure considering shear behavior of joint layer

Yamagiwa, M., Fujita, M., Yu, Q. & Sugihara, H. 2010 Jun 25 Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 1, p. 849-855 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Temperature
Mountings
Finite element method
Metals
Gallium nitride

Study on high reliable design method for lead-free solder joints on electronic components

Takagi, K., Yu, Q., Shibutani, T. & Noro, Y. 2010 Aug 9 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501281

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Crack propagation
Soldering
Lead-free solders
Automobile electronic equipment

Thermal fatigue reliability of high-temperature-resistant joint for power devices

Sugihara, H., Yamagiwa, M., Fujita, M., Oshidari, T. & Yu, Q. 2010 Jun 25 Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 1, p. 937-943 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Temperature
Thermal fatigue
Silicon carbide
Mountings
Plating
2009

A mesurement method using bi-metal fixture for non-linear property of thin layer joint

Yamagiwa, M., Yu, Q. & Fujita, M. 2009 Sep 17 ASME International Mechanical Engineering Congress and Exposition, Proceedings. Vol. 6, p. 79-85 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nanoparticles
Temperature
Soldering alloys
Metals
Silicon carbide
1 Citations

A study on the thermal deformation and the mechanical properties due to curing process of the encapsulation resin

Sato, H. & Yu, Q. 2009 Dec 1 Proceedings of the Electronic Packaging Technology Conference, EPTC. p. 991-995 5 p. 5416399

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Curing
Resins
Aluminum
Mechanical properties
Correlation methods

Ball impact response based on modeling techniques

Shinohara, K., Yu, Q., Fujita, M., Ishii, H. & Ishikawa, H. 2009 Dec 1 Proceedings of the Electronic Packaging Technology Conference, EPTC. p. 828-833 6 p. 5416434

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Stress concentration
Substrates
Impact strength
Printed circuit boards
Engineers
Vehicle performance
Thermal fatigue
Cluster analysis
Polychlorinated biphenyls

Effect of irregular grown intermetallic compounds network on tin whisker formation

Shibutani, T., Yamashita, T., Qiang, Y. & Shiratori, M. 2009 Jan 1 In : Journal of Japan Institute of Electronics Packaging. 12, 1, p. 53-61 9 p.

Research output: Contribution to journalArticle

Intermetallics
Tin
Stress concentration
Tinning
Plating
Resins
Silicon
Bending tests
Cracks
Finite element method

Fatigue evaluation of power devices

Shinohara, K. & Yu, Q. 2009 Nov 25 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 1277-1283 7 p. 5270605

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue of materials
Finite element method
Wire
Thermal fatigue
Joule heating
Fatigue of materials
Soldering alloys
Thermal fatigue
Miners
Sensitivity analysis

Reliability analysis of solder joint on power module

Yu, Q., Anzawa, T., Yamagiwa, M., Shibutani, T. & Shinohara, K. 2009 Oct 1 In : Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A. 75, 758, p. 1340-1346 7 p.

Research output: Contribution to journalArticle

Soldering alloys
Crack propagation
Fatigue of materials
Cracks
Thermal fatigue
1 Citations

Reliability evaluation of fatigue life for solder joints in chip components considering shape dispersion

Nishimura, Y., Yu, Q. & Maruoka, T. 2009 Dec 1 Proceedings of the Electronic Packaging Technology Conference, EPTC. p. 838-845 8 p. 5416426

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue of materials
Soldering alloys
Thermal fatigue
Miners
Fatigue crack propagation