Personal profile

e-rad ID

80242379

Researchmap ID

1000280066

Research Interests

(no English)

URL

http://er-web.jmk.ynu.ac.jp/html/YU_Qiang/en.html

External positions

Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

  • 1 Similar Profiles
Soldering alloys Engineering & Materials Science
Fatigue of materials Engineering & Materials Science
Temperature Engineering & Materials Science
Finite element method Engineering & Materials Science
Thermal fatigue Engineering & Materials Science
Cracks Engineering & Materials Science
Creep Engineering & Materials Science
Substrates Engineering & Materials Science

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Research Output 1990 2015

  • 597 Citations
  • 12 h-Index
  • 138 Conference contribution
  • 77 Article
  • 8 Chapter
9 Citations

A method to investigate strain rate effects on necking and fracture behaviors of advanced high-strength steels using digital imaging strain analysis

Sato, K., Yu, Q., Hiramoto, J., Urabe, T. & Yoshitake, A. 2015 Jan 1 In : International Journal of Impact Engineering. 75, p. 11-26 16 p.

Research output: Contribution to journalArticle

Strain rate
High strength steel
High speed cameras
Video cameras
Imaging techniques

Study on fatigue reliability evaluation for lead free solder joints

Mizukami, D., Matsuo, R. & Yu, Q. 2015 Feb 24 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 117-120 4 p. 7048364

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kinematics
Hardening
Fatigue of materials
Cracks
Lead-free solders

Study on local deformation of void affecting mechanical property of nanomaterial

Saito, Y., Yoden, K., Okuno, S. & Yu, Q. 2015 Feb 24 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 242-245 4 p. 7048363

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nanostructured materials
Mechanical properties
Structural analysis
Cracks
Crack initiation

Proposal of the application of the delamination test to semiconductor package design

Kusama, R., Ishikawa, T., Yu, Q., Yamashita, K. & Takeda, T. 2014 Jan 1 2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society, p. 732-735 4 p. 6826777

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Delamination
Sheet molding compounds
Computer aided engineering
Tensile stress
Loads (forces)
2 Citations
Fatigue of materials
Thermal fatigue
Thermal cycling
Printed circuit boards
Finite element method